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  • Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

    by Hengyun Zhang, Wensheng Zhao, Faxing Che, Tingyu Lin ...
    Series series Woodhead Publishing Series in Electronic and Optical Materials
    Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling ... Read more

    $211.49 USD